This event is endorsed
and organized by

4th EAI International Conference on e-Learning e-Education and Online Training

January 26–27, 2018 | Switzerland

Engaging the students

As the world of technology offers a rapidly increasing number of outlets for creativity and communications, the world of education is undergoing a significant renovation. Each day more classrooms can be accessed from anywhere, at any time. This year's conference aims at exploring e-learning solutions that spark the attention as well as imagination of students through interactivity, immersion, variety of content, or cutting-edge technologies.

The works that will be presented at eLEOT 2017 will focus on the following topics:
• Accessibility and usability of web-based instruction
• Assessment
• Augmented reality solutions
• Best Practices
• Big Data in e-learning
• Blended learning
• Collaborative learning and social networks
• High-impact practices in e-learning
• Informal e-Learning solutions
• Learning analytics
• Massive Open Online Course
• Mobile learning
• Security and privacy in education and e-learning systems
• Social and organizational perspectives
• Student engagement
• Teaching/Educational Models, Frameworks and Platforms
• Virtual Learning Environments



  • The event is endorsed by the European Alliance for Innovation, a leading community-based organisation devoted to the advancement of innovation in the field of ICT.
  • All accepted papers will be published by Springer and made available through SpringerLink Digital Library, one of the world's largest scientific libraries.
  • "Proceedings are submitted for inclusion to the leading indexing services: EI, ISI Thomson's Scientific and Technical Proceedings at Web of Science, Scopus, CrossRef, Google Scholar, DBLP, as well as EAI's own EU Digital Library (EUDL)."

  • Accepted Authors will be invited to submit an extended version of their work to Special Issue in EAI Endorsed Transactions.

Paper Submission

Papers should be submitted via Confy system. Please follow instructions on initial submission and in author's kit when submitting your paper.